Aug. 24 - According to sources at IC design companies, Ge-core recently broke the news that it will increase prices for some customers and processes by up to 8 percent in 2023.
The report comments that the backbone of the price hike against the trend lies in two aspects: on the one hand, Ge-core's previous offer is lower than that of its competitors; on the other hand, it comes from the recent cooperation between Ge-core and Qualcomm, which reached a total of $7.4 billion in purchase commitment orders until 2028.
In addition, the sources said, Samsung's current 5/4nm yield has increased, continue to take the "good die" offer mode, although the counter-trend up, but because the previous foundry offer is relatively affordable, up after the price is still lower than the competition, should be able to win many customer cooperation opportunities.
Sources said TSMC intends to maintain its planned 6-8% price increase from next year, although IC design companies are actively renegotiating with foundries on next year's wafer foundry offers.
TSMC has already made a 10-20% increase in its offer this year. One of TSMC's US customers has agreed to accept the foundry's plan for a 7% price increase on next year's orders, with the increasing costs being passed on to the end customer.
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