Samsung's strong focus on advanced foundry processes, following the announcement at the end of June that 3nm is leading the industry in mass production, 4nm is being expanded with a significant increase in yield, and is expected to add up to 20,000 wafers per month in the 4th quarter of this year, and plans to spend about 5 trillion won (about NT$114 billion) in 4nm investment to compete with TSMC, in order to grab more Qualcomm, Supermicro, Nvidia and other major manufacturers from TSMC. The company's investment in TSMC is expected to lead to more foundry orders from TSMC for Qualcomm, Supermicro, Nvidia and other major companies.
In response to the news, Samsung said it could not confirm the issue of increased production and investment. TSMC also did not respond to the competitor's message yesterday (17).
South Korean media infostockdaily reported that the 4nm capacity of Samsung Electronics' foundry business will be expanded in place. infostockdaily revealed that Samsung foundry's 4nm process has increased to nearly 60% because of the yield, with customer demand rising and the decision to expand production, the related investment injection, Samsung foundry in 4nm investment will reach about 5 trillion won (equivalent to about 114 billion NTD).
The industry pointed out that Samsung Group's foundry capacity used to provide about 60% of its own chip production, the rest to take outsourced orders, this year continued to actively expand production, and expand to take foundry orders, the proportion of its own chip production capacity to 50%, so as to enhance the semiconductor business profitability in the memory market headwinds. Research institutions estimate that Samsung in the advanced process capacity scale is still only about TSMC one-fifth.
Samsung is actively expanding in the foundry advanced process, but also integrate the group's resources to expand the advantages of receiving orders, its Samsung Electronics and Samsung Electro-Mechanics actively integrated complete advanced packaging, the sword pointed to TSMC another major customer super micro high-speed computing chip orders.
Samsung Electro-Mechanics recently issued a press release pointed out that the second half of this year, growth momentum in South Korea's first local server with FCBGA carrier board (commonly known as ABF carrier board) mass production, with the Samsung Group advanced packaging carrier board required, will be applied to servers, network communications and automotive field.
Samsung Electronics has publicly stated that its capital expenditure in Q2 is focused on the infrastructure of its P3 plant in Pyeongtaek, South Korea, as well as on process upgrades at its Hwaseong, Pyeongtaek and Xi'an plants on the mainland.
According to Samsung's plan, the new P3 plant in Pyeongtaek is scheduled to enter the plant from May to July, about a month earlier than the original, and will first open storage flash server (NAND Flash) capacity, followed by plans to open 3nm foundry capacity.
